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更多>>法國(guó)JAUCH品牌推薦Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
來(lái)源：http://m.dhuygw.com 作者：zhaoxiandz 2022年06月27
法國(guó)約克JAUCH品牌推薦Q 24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
石英晶體振蕩器的操作說(shuō)明
-1-Jauch晶振石英有限公司
通常,石英晶體振蕩器被設(shè)計(jì)成對(duì)環(huán)境相當(dāng)不敏感
條件,但在運(yùn)輸、儲(chǔ)存和生產(chǎn)過(guò)程中應(yīng)注意避免
晶體振蕩器性能惡化,甚至破壞內(nèi)置的晶體基
組件.Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
1. Storage conditions and moisture
A crystal oscillator is a hermetically sealed device; therefore no humidity gets inside the cavity of its
package. As the handling conditions and the pre-production conditioning being defined in JEDEC
J-STD-020 do only apply to non-hermetic devices, they basically do not apply to quartz crystal
components.
Nevertheless, long storage of quartz crystal oscillators at hot and humid conditions should be avoided.
Therefore, we recommend storing our oscillators within the conditions described as MSL level 2, to
avoid slight oxidation of the component’s contact pins.
SMD oscillators with gold-plated contact pads are even less susceptible to pad oxidation, and storage
temperature and humidity conditions according to MSL level 1 may be applied.
During storage of the component, the storage conditions should never exceed the temperature limits as
specified in the catalogue or datasheets. Please note that the storage temperature range applies to the
component only.
Preferably, please keep the storage temperature between +10° ~ +45°C (50°F ~ 115°F) and below
60% RH as long as the component is packed and reeled.
If the oscillators were stored over a long period or the storage conditions were not appropriate, before
using please make sure that the crystal components still comply to their specifications by performing
visual and electrical inspections.
2. Transportation and Handling
During transportation and during the manufacturing process, please avoid high shock and vibration
levels to quartz crystal oscillators, which are exceeding their maximum specifications. Severe drops or
being hit with a hard object could also cause damages to the component.
Quartz crystal oscillators which have suffered from excessive shocks and vibrations may show partial or
full cracks of their built-in crystal plate (crystal blank), or partial cracks of their cementing points, which
might lead to intermittent failures of the component.
Handling Notes for Quartz Crystal Oscillators
- 2 - Jauch Quartz GmbH
3. Mounting
• SMD oscillators
Please make sure not to exceed the appropriate reflow conditions as recommended in the
component specification, such as the peak temperature, the maximum duration, the number of
exposures, the rate of temperature change vs. time, etc.
Hand Soldering can be performed at a temperature of 350°C max. for 3 sec. max.
Soldering on the metallic package surface or the welded packaging edges is not allowed.
Please avoid extreme deformations of the board. Deformations may result in a detachment of
the PCB contact pad, a detachment of the SMD oscillator terminals or cracks in the solder
joints.
Full attention is requested especially when splitting the board with the component already
mounted. Any deformation or bending of the board should be avoided.
Should an automatic mounting system be used, please select an equipment with minor shock
generation, and check for the intensity of the shock before use.
• Pin type components
Please do not apply excessive soldering heat or soldering duration on the oscillator terminals.
Please refer to the recommended wave soldering conditions.
Hand Soldering can be performed at a temperature of 350°C max. for 3 sec. max.
Soldering of the metallic package surface (for example for mechanical fixation) is not allowed.
Do not apply excessive force to cut or bend leads. Doing so could crack the glass insulation or
resin seal and cause a leak which deteriorates the oscillator performance.
When bending crystal oscillator leads for SMD mount, please do not bend the pins directly at
the oscillator package, which might cause a crack in the glass insulation at the body of the
package. We recommend using an appropriate bending tool to keep a safe distance between
the component body and the bending point.
4. Cleaning
Ultrasonic cleaning should be avoided due to the risk of damage to the crystal blank inside the
oscillator.
If ultrasonic cleaning is used, there is a risk of generating mechanical resonances, which may cause an
intermittent or permanent damage of the crystal oscillator. Please be aware that ultrasonic waves
propagate over a board in a way which is not under control of the oscillator manufacturer.
Therefore, it is impossible for us to confirm each customer's mounting and cleaning conditions, such as
the mechanical resonance conditions of the board, the cleaner's type, the applied power, the time, the
placement in the cleaning tank and so on. Consequently, we are unable to define general conditions for
cleaning or guidelines to protect our component against damage.
Handling Notes for Quartz Crystal Oscillators
- 3 - Jauch Quartz GmbH
If ultra-sonic waves are used during cleaning or manufacturing, please make sure to perform an
appropriate inspection to make sure that the quartz crystal oscillator still meets its specification.
Moreover, if there is a change in cleaning conditions, board or placement of the component after a
redesign of the board, please be sure to perform the same inspection for confirmation.
• Cleaning Solvents
It is recommended that aqueous cleaning methods such as demineralized water or highpressure water cleaning is used in order to avoid physical damage caused by solvents. Some
aggressive solvents (such as those containing Chlorine), may cause an oxidation of the metallic
crystal oscillator packages or a discoloration on the component surface or marking. Do not
exceed a temperature of +50°C (120°F) during cleaning.
5. ESD Handling and Packing
All Jauch oscillators use a built-in semiconductor die / chip being based on (H)CMOS technology, which
is sensitive against electrostatic discharges. Hence, for our quartz crystal oscillators, the same typical
rules for ESD protection apply as for other (H)CMOS devices.
We deliver all our oscillator products in anti-static bags to meet the requirements of ESD compliant
production environments. We use various ESD compliant packing methods such as anti-static tube,
foam or ESD compliant tape and reel on our products. We recommend opening packaging tubes or
bags in ESD compliant environment to avoid damage to our products.
6. Operating Conditions
• Supply Voltage and Polarity
Jauch crystal oscillators should be operated inside the specified supply voltage and voltage
tolerances as given in the catalogue or datasheets. An operation outside the supply voltage
specification could cause intermittent or total failures of the crystal oscillator.
Reversed polarity connections may cause the unit to be irreversibly damaged electrically (dead)
and/or mechanically (burn). Therefore, please confirm the correct voltage polarity before
powering up the oscillator device.
• Supply Voltage Limits
Under any circumstance, please apply a supply voltage level to the oscillator which is not
exceeding the absolute maximum value, being typically 7V DC max. for most (H)CMOS IC’s.
Please also note that supply voltages below 70 ~ 80% of the nominal voltage may cause an
unstable operation of the oscillator.
1.儲(chǔ)存條件和濕度Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
晶體振蕩器是一種密封裝置；因此沒(méi)有濕氣進(jìn)入它的空腔
包裹.因?yàn)樵贘EDEC中定義了處理?xiàng)l件和生產(chǎn)前調(diào)節(jié)
J-STD-020只適用于非密封設(shè)備,基本上不適用于石英晶體
組件.
然而,應(yīng)避免石英晶體振蕩器在濕熱條件下長(zhǎng)時(shí)間儲(chǔ)存.
因此,我們建議將我們的振蕩器儲(chǔ)存在MSL 2級(jí)條件下
避免組件觸針的輕微氧化.
帶有鍍金接觸焊盤的SMD振蕩器更不容易被焊盤氧化和儲(chǔ)存
可以應(yīng)用符合MSL 1級(jí)標(biāo)準(zhǔn)的溫度和濕度條件.
在組件儲(chǔ)存期間,儲(chǔ)存條件不得超過(guò)溫度限制,因?yàn)?br /> 在目錄或數(shù)據(jù)表中規(guī)定.請(qǐng)注意,儲(chǔ)存溫度范圍適用于
僅組件.
最好將儲(chǔ)存溫度保持在+10 ~+45°C(50°F ~ 115°F)以下
60%相對(duì)濕度,只要包裝和卷繞部件.
如果振蕩器儲(chǔ)存時(shí)間過(guò)長(zhǎng)或儲(chǔ)存條件不合適,之前
使用請(qǐng)確保晶體元件仍然符合其規(guī)格,方法是執(zhí)行
目視和電氣檢查.
2.運(yùn)輸和處理
在運(yùn)輸和制造過(guò)程中,請(qǐng)避免強(qiáng)烈的沖擊和振動(dòng)
石英晶體振蕩器的水平,超過(guò)了它們的最大規(guī)格.嚴(yán)重下降或
被硬物撞擊也可能導(dǎo)致部件損壞.
遭受過(guò)度沖擊和振動(dòng)的石英晶體振蕩器可能會(huì)出現(xiàn)部分或全部損壞
內(nèi)置水晶片(水晶坯)全部開裂,或粘接點(diǎn)部分開裂
可能會(huì)導(dǎo)致組件的間歇性故障.
3.增加
SMD振蕩器
請(qǐng)確保不要超過(guò)中推薦的適當(dāng)回流條件
組件規(guī)格,如峰值溫度、最大持續(xù)時(shí)間、數(shù)量
暴露、溫度隨時(shí)間變化的速率等.
手工焊接可以在最高350°C的溫度下進(jìn)行.3秒鐘.最大值
不允許在金屬包裝表面或焊接包裝邊緣進(jìn)行焊接.
請(qǐng)避免板的極端變形.變形可能會(huì)導(dǎo)致
PCB接觸焊盤、SMD晶振振蕩器端子的分離或焊料中的裂紋
關(guān)節(jié).
特別是在拆分已經(jīng)帶有元件的電路板時(shí),需要特別注意
已安裝.應(yīng)避免板的任何變形或彎曲.
如果使用自動(dòng)安裝系統(tǒng),請(qǐng)選擇震動(dòng)較小的設(shè)備
生成,并在使用前檢查震動(dòng)強(qiáng)度.
引腳型組件
請(qǐng)不要在振蕩器端子上施加過(guò)多的焊接熱量或焊接時(shí)間.
請(qǐng)參考推薦的波峰焊條件.
手工焊接可以在最高350°C的溫度下進(jìn)行.3秒鐘.最大值
不允許焊接金屬包裝表面(例如用于機(jī)械固定).
不要過(guò)度用力切割或彎曲導(dǎo)線.這樣做可能會(huì)使玻璃隔熱層破裂或
樹脂密封并導(dǎo)致泄漏,從而降低振蕩器的性能.
當(dāng)彎曲用于SMD安裝的晶體振蕩器引線時(shí),請(qǐng)不要直接彎曲引腳
振蕩器封裝,這可能會(huì)導(dǎo)致殼體上的玻璃絕緣層破裂
包裹.我們建議使用合適的彎曲工具來(lái)保持安全距離
部件主體和彎曲點(diǎn).
4.清潔
應(yīng)避免超聲波清洗,因?yàn)榇嬖趽p壞內(nèi)部晶體坯的風(fēng)險(xiǎn)
振蕩器.
如果使用超聲波清洗,存在產(chǎn)生機(jī)械共振的風(fēng)險(xiǎn),這可能導(dǎo)致
晶體振蕩器的間歇性或永久性損壞.請(qǐng)注意超聲波
以不受振蕩器制造商控制的方式在電路板上傳播.
因此,我們不可能確認(rèn)每個(gè)客戶的安裝和清潔條件,例如
紙板的機(jī)械共振條件、清潔器的類型、施加的功率、時(shí)間
放置在清洗槽中等等.因此,我們無(wú)法定義的一般條件
清潔或指南,以保護(hù)我們的組件免受損壞.
如果在清潔或制造過(guò)程中使用超聲波,請(qǐng)確保執(zhí)行
適當(dāng)?shù)臋z查,以確保石英晶體振蕩器仍然符合其規(guī)格.
此外,如果清潔條件、電路板或元件放置在
板的重新設(shè)計(jì),請(qǐng)務(wù)必執(zhí)行相同的檢查確認(rèn).
清潔劑
建議使用含水清洗方法,如軟化水或高壓水清洗,以避免溶劑造成的物理?yè)p壞.一些
腐蝕性溶劑(如含氯溶劑)可能會(huì)導(dǎo)致金屬氧化Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
晶體振蕩器封裝或部件表面或標(biāo)記變色.不
清潔過(guò)程中溫度超過(guò)+50°C(120°F).
5.ESD處理和包裝
所有Jauch振蕩器都使用基于(H)CMOS技術(shù)的內(nèi)置半導(dǎo)體芯片
對(duì)靜電放電敏感.因此,對(duì)于我們的進(jìn)口晶振石英晶體振蕩器,相同的典型
ESD保護(hù)規(guī)則適用于其他(H)CMOS器件.
我們交付的所有振蕩器產(chǎn)品都裝在防靜電袋中,以滿足ESD合規(guī)要求
生產(chǎn)環(huán)境.我們使用各種符合ESD標(biāo)準(zhǔn)的包裝方法,
我們產(chǎn)品上的泡沫或ESD兼容膠帶和卷軸.我們建議打開包裝管或
袋子放在符合ESD標(biāo)準(zhǔn)的環(huán)境中,以避免損壞我們的產(chǎn)品.
6.操作件
電源電壓和極性
晶振應(yīng)在規(guī)定的電源電壓和電壓范圍內(nèi)工作
目錄或數(shù)據(jù)表中給出的公差.電源電壓以外的操作
規(guī)格可能會(huì)導(dǎo)致晶體振蕩器的間歇性或完全故障.
極性相反的連接可能會(huì)導(dǎo)致設(shè)備不可逆的電氣損壞(斷電)
和/或機(jī)械方式(燃燒).因此,請(qǐng)?jiān)谥按_認(rèn)正確的電壓極性
給振蕩器裝置加電.
電源電壓限值
在任何情況下,請(qǐng)對(duì)振蕩器施加一個(gè)電源電壓電平
超過(guò)絕對(duì)最大值,通常為7V DC最大值.對(duì)于大多數(shù)(H)CMOS集成電路.
還請(qǐng)注意,低于標(biāo)稱電壓70 ~ 80%的電源電壓可能會(huì)導(dǎo)致
振蕩器的不穩(wěn)定運(yùn)行.
Jauch集團(tuán)是石英晶體、晶體振蕩器和電池技術(shù)的領(lǐng)先專家之一. 成立于1954年,我們現(xiàn)在是頻率控制產(chǎn)品行業(yè)的領(lǐng)先公司之一,是鋰離子和鋰聚合物電池未來(lái)市場(chǎng)的公認(rèn)專家.
我們以深入的技術(shù)咨詢、高應(yīng)用和認(rèn)證專業(yè)知識(shí)、先進(jìn)的測(cè)試環(huán)境、高可用性和快速交付的產(chǎn)品以及世界上最大的頻率產(chǎn)生設(shè)備倉(cāng)庫(kù)之一來(lái)強(qiáng)調(diào)我們的領(lǐng)導(dǎo)地位.
我們?cè)谖挥诰S林根-施文寧根的總部投資了生產(chǎn)設(shè)施,以及時(shí)滿足世界各地客戶的需求.
現(xiàn)代化的電池裝配線,滿足高技術(shù)要求的電池解決方案,確保生產(chǎn)適用于各種應(yīng)用的單個(gè)電池組.
我們的子公司Jauch Quartz法國(guó)、Jauch Quartz英國(guó)和Jauch Quartz美國(guó)的優(yōu)秀員工開發(fā)和銷售開拓性的技術(shù)解決方案Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振.
WE ARE JAUCH
The Jauch Group is one of the leading specialists for quartz crystals, crystal oscillators and battery technology. Established in 1954, we are now one of the leading companies in the frequency control products industry and a recognized expert on the future market for lithium ion and lithium polymer batteries.
We underline our claim to leadership with our in-depth technical consulting, high application, and certification expertise, advanced test environments, high availability and fast delivery of products and one of the world’s largest warehouses for frequency generating devices.
We have invested in production facilities at our headquarters in Villingen-Schwenningen to meet customer needs around the world in a timely manner.
A modern batteries assembly line for battery solutions with high technical requirements ensures the production of individual battery packs for various applications.
Our competent staff at our subsidiaries Jauch Quartz France, Jauch Quartz United Kingdom and Jauch Quartz America develop and sell pioneering technology solutions.
JAUCH 博客O 20.0-JO32-G-1V3-1-T1-LF
節(jié)奏和能量是推動(dòng)和驅(qū)動(dòng)世界的力量.我們?cè)?Jauch 的世界尤其受到這些沖動(dòng)的影響.頻率控制產(chǎn)品和電池解決方案決定了我們的日常生活,每天給我們節(jié)奏和能量.最重要的是,我們的員工是使 Jauch 成為一家非常特別的公司的因素.
在我們的博客中,我們將帶您了解我們的產(chǎn)品、員工和 Jauch 企業(yè)文化,為您提供 Jauch G 集團(tuán)幕后令人興奮的見(jiàn)解.我們期待與您分享!
從組裝到最終產(chǎn)品——石英制造過(guò)程的最后階段Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
在博文中問(wèn)產(chǎn)品經(jīng)理:真正的水晶是用于生產(chǎn)振蕩石英晶體的嗎?和石英生產(chǎn)流程:從石英塊到石英坯,我們已經(jīng)深入了解了石英生產(chǎn)的第一階段,石英坯是由什么材料制成的,以及具有一定頻率的石英坯需要哪些步驟.由石英塊制成.我們現(xiàn)在處于制造成品部件的過(guò)程中的以下階段:石英毛坯已經(jīng)生產(chǎn)貼片晶振,甚至電極也已經(jīng)汽化,并且已經(jīng)檢查了頻率.現(xiàn)在必須將擋板安裝到外殼中.這聽起來(lái)很簡(jiǎn)單,但即使在這里也有一兩點(diǎn)需要考慮,因此最終的結(jié)果是高質(zhì)量和耐用的石英.安裝到外殼中要將坯件安裝到外殼中,首先要在外殼底座上涂上導(dǎo)電粘合劑.下一步是固定石英空白.O 16,0-JO32-B-1V3-1-T1-LF
在外殼中安裝石英毛坯最終頻率調(diào)整現(xiàn)在最后一次調(diào)整頻率.使用兩種不同的方法,必要時(shí)調(diào)整目標(biāo)頻率.一方面,如果頻率太高,可以氣相沉積額外的電極材料.這一步降低了頻率.或者,用等離子體部分去除電極材料可以增加頻率.
最終頻率調(diào)整外殼是密封的接下來(lái),密封外殼.有幾種方法可以做到這一點(diǎn).經(jīng)常使用"接縫密封"方法.在這個(gè)過(guò)程中,金屬蓋和包裝用電極焊接在一起.在此博客文章中了解有關(guān)此主題的更多信息.
使用接縫密封方法密封外殼最后階段在進(jìn)行最終測(cè)試、包裝和運(yùn)輸之前,石英在激光或特殊墨水的幫助下進(jìn)行標(biāo)記.現(xiàn)在石英晶振晶體已經(jīng)完成,可以安裝在板上了.本文件以清晰直觀的方式列出了石英制造過(guò)程中的所有階段.
石英晶體振蕩器被設(shè)計(jì)成對(duì)環(huán)境影響相當(dāng)不敏感.然而,在處理它們時(shí)需要考慮一些要點(diǎn),以使產(chǎn)品的性能不受影響.
本文件提供了關(guān)于正確操作石英晶體振蕩器的結(jié)構(gòu)概述.
Handling Notes for Quartz Crystal Oscillators - 1 - Jauch Quartz GmbH quartz crystal oscillators are designed to be quite insensitive against environmental conditions, nevertheless care should be taken during transportation, storing and production to avoid deteriorations of the crystal oscillator performance, or even destruction of the built-in crystal based component.
深圳市壹兆電子科技有限公司
SHENZHENYIZHAOEL.ECTRONICSCO,LTD
晶振人:龔成石英晶振熱線:13590198504
晶振廠家電話:0755-27876236QQ:769468702
E-mail:zhaoxiandz@163.com
網(wǎng)址:http://m.dhuygw.com
有源晶振溫補(bǔ)晶振銷售地址:深圳市南山區(qū)南頭關(guān)口8棟
石英晶體振蕩器的操作說(shuō)明
-1-Jauch晶振石英有限公司
通常,石英晶體振蕩器被設(shè)計(jì)成對(duì)環(huán)境相當(dāng)不敏感
條件,但在運(yùn)輸、儲(chǔ)存和生產(chǎn)過(guò)程中應(yīng)注意避免
晶體振蕩器性能惡化,甚至破壞內(nèi)置的晶體基
組件.Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
1. Storage conditions and moisture
A crystal oscillator is a hermetically sealed device; therefore no humidity gets inside the cavity of its
package. As the handling conditions and the pre-production conditioning being defined in JEDEC
J-STD-020 do only apply to non-hermetic devices, they basically do not apply to quartz crystal
components.
Nevertheless, long storage of quartz crystal oscillators at hot and humid conditions should be avoided.
Therefore, we recommend storing our oscillators within the conditions described as MSL level 2, to
avoid slight oxidation of the component’s contact pins.
SMD oscillators with gold-plated contact pads are even less susceptible to pad oxidation, and storage
temperature and humidity conditions according to MSL level 1 may be applied.
During storage of the component, the storage conditions should never exceed the temperature limits as
specified in the catalogue or datasheets. Please note that the storage temperature range applies to the
component only.
Preferably, please keep the storage temperature between +10° ~ +45°C (50°F ~ 115°F) and below
60% RH as long as the component is packed and reeled.
If the oscillators were stored over a long period or the storage conditions were not appropriate, before
using please make sure that the crystal components still comply to their specifications by performing
visual and electrical inspections.
2. Transportation and Handling
During transportation and during the manufacturing process, please avoid high shock and vibration
levels to quartz crystal oscillators, which are exceeding their maximum specifications. Severe drops or
being hit with a hard object could also cause damages to the component.
Quartz crystal oscillators which have suffered from excessive shocks and vibrations may show partial or
full cracks of their built-in crystal plate (crystal blank), or partial cracks of their cementing points, which
might lead to intermittent failures of the component.
Handling Notes for Quartz Crystal Oscillators
- 2 - Jauch Quartz GmbH
3. Mounting
• SMD oscillators
Please make sure not to exceed the appropriate reflow conditions as recommended in the
component specification, such as the peak temperature, the maximum duration, the number of
exposures, the rate of temperature change vs. time, etc.
Hand Soldering can be performed at a temperature of 350°C max. for 3 sec. max.
Soldering on the metallic package surface or the welded packaging edges is not allowed.
Please avoid extreme deformations of the board. Deformations may result in a detachment of
the PCB contact pad, a detachment of the SMD oscillator terminals or cracks in the solder
joints.
Full attention is requested especially when splitting the board with the component already
mounted. Any deformation or bending of the board should be avoided.
Should an automatic mounting system be used, please select an equipment with minor shock
generation, and check for the intensity of the shock before use.
• Pin type components
Please do not apply excessive soldering heat or soldering duration on the oscillator terminals.
Please refer to the recommended wave soldering conditions.
Hand Soldering can be performed at a temperature of 350°C max. for 3 sec. max.
Soldering of the metallic package surface (for example for mechanical fixation) is not allowed.
Do not apply excessive force to cut or bend leads. Doing so could crack the glass insulation or
resin seal and cause a leak which deteriorates the oscillator performance.
When bending crystal oscillator leads for SMD mount, please do not bend the pins directly at
the oscillator package, which might cause a crack in the glass insulation at the body of the
package. We recommend using an appropriate bending tool to keep a safe distance between
the component body and the bending point.
4. Cleaning
Ultrasonic cleaning should be avoided due to the risk of damage to the crystal blank inside the
oscillator.
If ultrasonic cleaning is used, there is a risk of generating mechanical resonances, which may cause an
intermittent or permanent damage of the crystal oscillator. Please be aware that ultrasonic waves
propagate over a board in a way which is not under control of the oscillator manufacturer.
Therefore, it is impossible for us to confirm each customer's mounting and cleaning conditions, such as
the mechanical resonance conditions of the board, the cleaner's type, the applied power, the time, the
placement in the cleaning tank and so on. Consequently, we are unable to define general conditions for
cleaning or guidelines to protect our component against damage.
Handling Notes for Quartz Crystal Oscillators
- 3 - Jauch Quartz GmbH
If ultra-sonic waves are used during cleaning or manufacturing, please make sure to perform an
appropriate inspection to make sure that the quartz crystal oscillator still meets its specification.
Moreover, if there is a change in cleaning conditions, board or placement of the component after a
redesign of the board, please be sure to perform the same inspection for confirmation.
• Cleaning Solvents
It is recommended that aqueous cleaning methods such as demineralized water or highpressure water cleaning is used in order to avoid physical damage caused by solvents. Some
aggressive solvents (such as those containing Chlorine), may cause an oxidation of the metallic
crystal oscillator packages or a discoloration on the component surface or marking. Do not
exceed a temperature of +50°C (120°F) during cleaning.
5. ESD Handling and Packing
All Jauch oscillators use a built-in semiconductor die / chip being based on (H)CMOS technology, which
is sensitive against electrostatic discharges. Hence, for our quartz crystal oscillators, the same typical
rules for ESD protection apply as for other (H)CMOS devices.
We deliver all our oscillator products in anti-static bags to meet the requirements of ESD compliant
production environments. We use various ESD compliant packing methods such as anti-static tube,
foam or ESD compliant tape and reel on our products. We recommend opening packaging tubes or
bags in ESD compliant environment to avoid damage to our products.
6. Operating Conditions
• Supply Voltage and Polarity
Jauch crystal oscillators should be operated inside the specified supply voltage and voltage
tolerances as given in the catalogue or datasheets. An operation outside the supply voltage
specification could cause intermittent or total failures of the crystal oscillator.
Reversed polarity connections may cause the unit to be irreversibly damaged electrically (dead)
and/or mechanically (burn). Therefore, please confirm the correct voltage polarity before
powering up the oscillator device.
• Supply Voltage Limits
Under any circumstance, please apply a supply voltage level to the oscillator which is not
exceeding the absolute maximum value, being typically 7V DC max. for most (H)CMOS IC’s.
Please also note that supply voltages below 70 ~ 80% of the nominal voltage may cause an
unstable operation of the oscillator.
1.儲(chǔ)存條件和濕度Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
晶體振蕩器是一種密封裝置；因此沒(méi)有濕氣進(jìn)入它的空腔
包裹.因?yàn)樵贘EDEC中定義了處理?xiàng)l件和生產(chǎn)前調(diào)節(jié)
J-STD-020只適用于非密封設(shè)備,基本上不適用于石英晶體
組件.
然而,應(yīng)避免石英晶體振蕩器在濕熱條件下長(zhǎng)時(shí)間儲(chǔ)存.
因此,我們建議將我們的振蕩器儲(chǔ)存在MSL 2級(jí)條件下
避免組件觸針的輕微氧化.
帶有鍍金接觸焊盤的SMD振蕩器更不容易被焊盤氧化和儲(chǔ)存
可以應(yīng)用符合MSL 1級(jí)標(biāo)準(zhǔn)的溫度和濕度條件.
在組件儲(chǔ)存期間,儲(chǔ)存條件不得超過(guò)溫度限制,因?yàn)?br /> 在目錄或數(shù)據(jù)表中規(guī)定.請(qǐng)注意,儲(chǔ)存溫度范圍適用于
僅組件.
最好將儲(chǔ)存溫度保持在+10 ~+45°C(50°F ~ 115°F)以下
60%相對(duì)濕度,只要包裝和卷繞部件.
如果振蕩器儲(chǔ)存時(shí)間過(guò)長(zhǎng)或儲(chǔ)存條件不合適,之前
使用請(qǐng)確保晶體元件仍然符合其規(guī)格,方法是執(zhí)行
目視和電氣檢查.
2.運(yùn)輸和處理
在運(yùn)輸和制造過(guò)程中,請(qǐng)避免強(qiáng)烈的沖擊和振動(dòng)
石英晶體振蕩器的水平,超過(guò)了它們的最大規(guī)格.嚴(yán)重下降或
被硬物撞擊也可能導(dǎo)致部件損壞.
遭受過(guò)度沖擊和振動(dòng)的石英晶體振蕩器可能會(huì)出現(xiàn)部分或全部損壞
內(nèi)置水晶片(水晶坯)全部開裂,或粘接點(diǎn)部分開裂
可能會(huì)導(dǎo)致組件的間歇性故障.
3.增加
SMD振蕩器
請(qǐng)確保不要超過(guò)中推薦的適當(dāng)回流條件
組件規(guī)格,如峰值溫度、最大持續(xù)時(shí)間、數(shù)量
暴露、溫度隨時(shí)間變化的速率等.
手工焊接可以在最高350°C的溫度下進(jìn)行.3秒鐘.最大值
不允許在金屬包裝表面或焊接包裝邊緣進(jìn)行焊接.
請(qǐng)避免板的極端變形.變形可能會(huì)導(dǎo)致
PCB接觸焊盤、SMD晶振振蕩器端子的分離或焊料中的裂紋
關(guān)節(jié).
特別是在拆分已經(jīng)帶有元件的電路板時(shí),需要特別注意
已安裝.應(yīng)避免板的任何變形或彎曲.
如果使用自動(dòng)安裝系統(tǒng),請(qǐng)選擇震動(dòng)較小的設(shè)備
生成,并在使用前檢查震動(dòng)強(qiáng)度.
引腳型組件
請(qǐng)不要在振蕩器端子上施加過(guò)多的焊接熱量或焊接時(shí)間.
請(qǐng)參考推薦的波峰焊條件.
手工焊接可以在最高350°C的溫度下進(jìn)行.3秒鐘.最大值
不允許焊接金屬包裝表面(例如用于機(jī)械固定).
不要過(guò)度用力切割或彎曲導(dǎo)線.這樣做可能會(huì)使玻璃隔熱層破裂或
樹脂密封并導(dǎo)致泄漏,從而降低振蕩器的性能.
當(dāng)彎曲用于SMD安裝的晶體振蕩器引線時(shí),請(qǐng)不要直接彎曲引腳
振蕩器封裝,這可能會(huì)導(dǎo)致殼體上的玻璃絕緣層破裂
包裹.我們建議使用合適的彎曲工具來(lái)保持安全距離
部件主體和彎曲點(diǎn).
4.清潔
應(yīng)避免超聲波清洗,因?yàn)榇嬖趽p壞內(nèi)部晶體坯的風(fēng)險(xiǎn)
振蕩器.
如果使用超聲波清洗,存在產(chǎn)生機(jī)械共振的風(fēng)險(xiǎn),這可能導(dǎo)致
晶體振蕩器的間歇性或永久性損壞.請(qǐng)注意超聲波
以不受振蕩器制造商控制的方式在電路板上傳播.
因此,我們不可能確認(rèn)每個(gè)客戶的安裝和清潔條件,例如
紙板的機(jī)械共振條件、清潔器的類型、施加的功率、時(shí)間
放置在清洗槽中等等.因此,我們無(wú)法定義的一般條件
清潔或指南,以保護(hù)我們的組件免受損壞.
如果在清潔或制造過(guò)程中使用超聲波,請(qǐng)確保執(zhí)行
適當(dāng)?shù)臋z查,以確保石英晶體振蕩器仍然符合其規(guī)格.
此外,如果清潔條件、電路板或元件放置在
板的重新設(shè)計(jì),請(qǐng)務(wù)必執(zhí)行相同的檢查確認(rèn).
清潔劑
建議使用含水清洗方法,如軟化水或高壓水清洗,以避免溶劑造成的物理?yè)p壞.一些
腐蝕性溶劑(如含氯溶劑)可能會(huì)導(dǎo)致金屬氧化Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
晶體振蕩器封裝或部件表面或標(biāo)記變色.不
清潔過(guò)程中溫度超過(guò)+50°C(120°F).
5.ESD處理和包裝
所有Jauch振蕩器都使用基于(H)CMOS技術(shù)的內(nèi)置半導(dǎo)體芯片
對(duì)靜電放電敏感.因此,對(duì)于我們的進(jìn)口晶振石英晶體振蕩器,相同的典型
ESD保護(hù)規(guī)則適用于其他(H)CMOS器件.
我們交付的所有振蕩器產(chǎn)品都裝在防靜電袋中,以滿足ESD合規(guī)要求
生產(chǎn)環(huán)境.我們使用各種符合ESD標(biāo)準(zhǔn)的包裝方法,
我們產(chǎn)品上的泡沫或ESD兼容膠帶和卷軸.我們建議打開包裝管或
袋子放在符合ESD標(biāo)準(zhǔn)的環(huán)境中,以避免損壞我們的產(chǎn)品.
6.操作件
電源電壓和極性
晶振應(yīng)在規(guī)定的電源電壓和電壓范圍內(nèi)工作
目錄或數(shù)據(jù)表中給出的公差.電源電壓以外的操作
規(guī)格可能會(huì)導(dǎo)致晶體振蕩器的間歇性或完全故障.
極性相反的連接可能會(huì)導(dǎo)致設(shè)備不可逆的電氣損壞(斷電)
和/或機(jī)械方式(燃燒).因此,請(qǐng)?jiān)谥按_認(rèn)正確的電壓極性
給振蕩器裝置加電.
電源電壓限值
在任何情況下,請(qǐng)對(duì)振蕩器施加一個(gè)電源電壓電平
超過(guò)絕對(duì)最大值,通常為7V DC最大值.對(duì)于大多數(shù)(H)CMOS集成電路.
還請(qǐng)注意,低于標(biāo)稱電壓70 ~ 80%的電源電壓可能會(huì)導(dǎo)致
振蕩器的不穩(wěn)定運(yùn)行.
Jauch集團(tuán)是石英晶體、晶體振蕩器和電池技術(shù)的領(lǐng)先專家之一. 成立于1954年,我們現(xiàn)在是頻率控制產(chǎn)品行業(yè)的領(lǐng)先公司之一,是鋰離子和鋰聚合物電池未來(lái)市場(chǎng)的公認(rèn)專家.
我們以深入的技術(shù)咨詢、高應(yīng)用和認(rèn)證專業(yè)知識(shí)、先進(jìn)的測(cè)試環(huán)境、高可用性和快速交付的產(chǎn)品以及世界上最大的頻率產(chǎn)生設(shè)備倉(cāng)庫(kù)之一來(lái)強(qiáng)調(diào)我們的領(lǐng)導(dǎo)地位.
我們?cè)谖挥诰S林根-施文寧根的總部投資了生產(chǎn)設(shè)施,以及時(shí)滿足世界各地客戶的需求.
現(xiàn)代化的電池裝配線,滿足高技術(shù)要求的電池解決方案,確保生產(chǎn)適用于各種應(yīng)用的單個(gè)電池組.
我們的子公司Jauch Quartz法國(guó)、Jauch Quartz英國(guó)和Jauch Quartz美國(guó)的優(yōu)秀員工開發(fā)和銷售開拓性的技術(shù)解決方案Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振.
WE ARE JAUCH
The Jauch Group is one of the leading specialists for quartz crystals, crystal oscillators and battery technology. Established in 1954, we are now one of the leading companies in the frequency control products industry and a recognized expert on the future market for lithium ion and lithium polymer batteries.
We underline our claim to leadership with our in-depth technical consulting, high application, and certification expertise, advanced test environments, high availability and fast delivery of products and one of the world’s largest warehouses for frequency generating devices.
We have invested in production facilities at our headquarters in Villingen-Schwenningen to meet customer needs around the world in a timely manner.
A modern batteries assembly line for battery solutions with high technical requirements ensures the production of individual battery packs for various applications.
Our competent staff at our subsidiaries Jauch Quartz France, Jauch Quartz United Kingdom and Jauch Quartz America develop and sell pioneering technology solutions.
JAUCH 博客O 20.0-JO32-G-1V3-1-T1-LF
節(jié)奏和能量是推動(dòng)和驅(qū)動(dòng)世界的力量.我們?cè)?Jauch 的世界尤其受到這些沖動(dòng)的影響.頻率控制產(chǎn)品和電池解決方案決定了我們的日常生活,每天給我們節(jié)奏和能量.最重要的是,我們的員工是使 Jauch 成為一家非常特別的公司的因素.
在我們的博客中,我們將帶您了解我們的產(chǎn)品、員工和 Jauch 企業(yè)文化,為您提供 Jauch G 集團(tuán)幕后令人興奮的見(jiàn)解.我們期待與您分享!
從組裝到最終產(chǎn)品——石英制造過(guò)程的最后階段Jauch晶振,Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
在博文中問(wèn)產(chǎn)品經(jīng)理:真正的水晶是用于生產(chǎn)振蕩石英晶體的嗎?和石英生產(chǎn)流程:從石英塊到石英坯,我們已經(jīng)深入了解了石英生產(chǎn)的第一階段,石英坯是由什么材料制成的,以及具有一定頻率的石英坯需要哪些步驟.由石英塊制成.我們現(xiàn)在處于制造成品部件的過(guò)程中的以下階段:石英毛坯已經(jīng)生產(chǎn)貼片晶振,甚至電極也已經(jīng)汽化,并且已經(jīng)檢查了頻率.現(xiàn)在必須將擋板安裝到外殼中.這聽起來(lái)很簡(jiǎn)單,但即使在這里也有一兩點(diǎn)需要考慮,因此最終的結(jié)果是高質(zhì)量和耐用的石英.安裝到外殼中要將坯件安裝到外殼中,首先要在外殼底座上涂上導(dǎo)電粘合劑.下一步是固定石英空白.O 16,0-JO32-B-1V3-1-T1-LF
在外殼中安裝石英毛坯最終頻率調(diào)整現(xiàn)在最后一次調(diào)整頻率.使用兩種不同的方法,必要時(shí)調(diào)整目標(biāo)頻率.一方面,如果頻率太高,可以氣相沉積額外的電極材料.這一步降低了頻率.或者,用等離子體部分去除電極材料可以增加頻率.
最終頻率調(diào)整外殼是密封的接下來(lái),密封外殼.有幾種方法可以做到這一點(diǎn).經(jīng)常使用"接縫密封"方法.在這個(gè)過(guò)程中,金屬蓋和包裝用電極焊接在一起.在此博客文章中了解有關(guān)此主題的更多信息.
使用接縫密封方法密封外殼最后階段在進(jìn)行最終測(cè)試、包裝和運(yùn)輸之前,石英在激光或特殊墨水的幫助下進(jìn)行標(biāo)記.現(xiàn)在石英晶振晶體已經(jīng)完成,可以安裝在板上了.本文件以清晰直觀的方式列出了石英制造過(guò)程中的所有階段.
石英晶體振蕩器被設(shè)計(jì)成對(duì)環(huán)境影響相當(dāng)不敏感.然而,在處理它們時(shí)需要考慮一些要點(diǎn),以使產(chǎn)品的性能不受影響.
本文件提供了關(guān)于正確操作石英晶體振蕩器的結(jié)構(gòu)概述.
Handling Notes for Quartz Crystal Oscillators - 1 - Jauch Quartz GmbH quartz crystal oscillators are designed to be quite insensitive against environmental conditions, nevertheless care should be taken during transportation, storing and production to avoid deteriorations of the crystal oscillator performance, or even destruction of the built-in crystal based component.
深圳市壹兆電子科技有限公司
SHENZHENYIZHAOEL.ECTRONICSCO,LTD
晶振人:龔成石英晶振熱線:13590198504
晶振廠家電話:0755-27876236QQ:769468702
E-mail:zhaoxiandz@163.com
網(wǎng)址:http://m.dhuygw.com
有源晶振溫補(bǔ)晶振銷售地址:深圳市南山區(qū)南頭關(guān)口8棟
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此文關(guān)鍵字： Jauch晶振Q24.0-JXS32-12-30/30-T1-FU-LF無(wú)源晶振
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